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[Information] Potting Solutions for Automotive Parts

[Information] Potting Solutions for Automotive Parts

Explanation of the polymer structure, synthesis, and analysis of 4.0 W/m·K thermal conductivity potting!

This document introduces the potting solutions for automotive parts from GOLOHO Polymer Materials Co., Ltd. It includes technical parameters for 4.0 W/m.K thermal conductive potting, as well as information on fluidity, selection of thermal conductive materials, and surface treatment of thermal conductive materials. The advantages of the product include low viscosity, excellent leveling properties, and outstanding sedimentation resistance. 【Contents (partial)】 ■ 4.0 W/m.K thermal conductive potting technical parameters ■ 4.0 W/m.K thermal conductive potting fluidity ■ 4.0 W/m.K thermal conductive potting selection of thermal conductive materials ■ 4.0 W/m.K thermal conductive potting surface treatment of thermal conductive materials ■ 4.0 W/m.K thermal conductive potting polymer structure *For more details, please refer to the PDF document or feel free to contact us.

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Sealing material / potting material

Sealing material / potting material

Introducing potting materials tailored to applications and environments to enhance the reliability of electronic devices.

Our company offers "encapsulants" and "potting materials" made from resins and silicones for insulation applications in substrates and electronic components. Leveraging over 70 years of experience and a network as a specialized trading company for insulation materials, we handle a wide range of products tailored to specific applications, allowing us to propose materials and select equipment according to your desired specifications. Please consider our products, which come with various added values, to enhance the reliability of your electronic devices. *For more details, please contact us via the link below. https://www.towadenki.co.jp/products/20210105-175/#at

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